The 5th International Forum on Engineering Education
Engineering Education Review (EER)
Call for Papers

 

I. Introduction to the Forum

The International Forum on Engineering Education is a series of international academic conferences jointly initiated and established by Tsinghua University, the Chinese Academy of Engineering, and the United Nations Educational, Scientific and Cultural Organization (UNESCO). The Forum aims to bring together distinguished scholars, university presidents, deans of engineering schools, and industry leaders from around the world in the fields of engineering education, engineering science and technology, and engineering management. It provides a global platform for in-depth discussions on the development of engineering education and emerging issues in engineering science and technology, with the goal of advancing innovation in engineering education, promoting progress in engineering and technological development, and contributing to sustainable social development.

Since its establishment in 2018, the Forum has been held biennially and has gradually developed into an internationally influential academic platform. It has played an important role in promoting innovation in global engineering education concepts, strengthening international collaboration, and facilitating knowledge exchange among engineering education communities worldwide.

The 5th International Forum on Engineering Education will be held at Tsinghua University in November 2026. Under the theme of:
“Engineering Education in the Era of Artificial Intelligence: Challenges and Opportunities”

the Forum will focus on four core dimensions of engineering education:

•Engineering Science: exploring the evolution of fundamental engineering theories and disciplinary systems driven by artificial intelligence; 

•Engineering Technology: examining the deep integration of artificial intelligence with key engineering domains, including energy transition, intelligent manufacturing, and smart cities; 

•Engineering Management: investigating systematic transformations in talent development models, educational systems, and organizational management mechanisms; 

•Engineering Culture: promoting the development of an engineering culture characterized by global perspectives, social responsibility, and humanistic values. 

The year 2026 marks the 100th anniversary of the formal establishment of engineering education at Tsinghua University. Against this important historical backdrop, the Forum will further explore pathways toward building a strong educational system, technological innovation capacity, and talent development framework, while advancing integrated reforms in education, science and technology, and talent cultivation systems.

To facilitate the dissemination and accumulation of academic outcomes generated from the Forum, Engineering Education Review (EER), the official English-language journal and academic partner of the Forum, will provide comprehensive academic support throughout the event.
Engineering Education Review (EER, ISSN: 2959-6890) is the world’s first international review journal dedicated to engineering education. Initiated by Tsinghua University in 2023, the journal was officially launched in October 2023 during the World Engineering Conference in Prague, Czech Republic. EER is committed to systematically reviewing research progress and scholarly achievements in engineering education and providing a high-level international platform for academic exchange among researchers worldwide.

 

 

II. Forum Themes

The 5th International Forum on Engineering Education will focus on the following key themes:

•  Exploring emerging trends and new challenges in engineering education development in the era of artificial intelligence; 

•  Sharing global experiences and innovative practices in engineering education reform; 

•  Promoting innovation in talent development models through the deep integration of artificial intelligence and engineering disciplines; 

•  Advancing international collaboration and interdisciplinary exchange in the field of engineering education; 

•  Providing new perspectives and approaches for cultivating high-level engineering and technological talent to meet the needs of future industries. 

 

 

III. Participants

The Forum is expected to attract approximately 200 participants, including:

•  University presidents and deans of engineering schools from China and abroad; 

•  Leading scholars in engineering education and engineering science and technology; 

•  Representatives from international organizations; 

•  Representatives from technology enterprises and industry sectors; 

•  Early-career scholars and researchers.

 

 

IV. Call for Papers

1. Submission Scope

Submitted manuscripts should be closely aligned with the theme of the Forum and address the challenges and opportunities facing engineering education in the era of artificial intelligence from one or more of the following four dimensions:

•  Engineering Science 

•  Engineering Technology 

•  Engineering Management 

•  Engineering Culture 

Submissions are expected to provide insights into the transformation and future development of engineering education in the context of artificial intelligence.

2. Manuscript Type

The Forum welcomes original academic research manuscripts in English that have not been previously published.

3. Formatting and Length Requirements

Manuscripts should be prepared strictly according to the formatting requirements specified in the Author Guidelines of Engineering Education Review (EER).

Author Guidelines:
https://www.ists.asia/journal/EER/EER-Author-Guidelines/

4. Submission Method

Please submit manuscripts in Microsoft Word format (.doc/.docx) to the designated submission email address.
The email subject line should follow the format:

IFEE 2026 Submission-[Corresponding Author’s Name]-[Manuscript Title]

The submitted Word file should be named according to the following format:

[Corresponding Author’s Name]-[Manuscript Title]-IFEE2026.doc

5. Important Dates

•  Submission Deadline: September 15, 2026 

•  Notification of Review Results: No later than October 30, 2026 

Authors who do not receive a notification by the above date will be considered as not having been accepted. In such cases, authors may make independent arrangements regarding their manuscripts.

6. Review and Publication

All submitted manuscripts will undergo peer review organized by experts in relevant fields.

Authors of accepted papers will be invited to present their work or showcase their research outcomes during the Forum.
Selected outstanding papers will be recommended for consideration for publication in Engineering Education Review (EER) and may receive priority in the publication process.

 

 

V. Contact Information

Submission and Inquiry Email:
submission@eerjournal.org

Please follow the above requirements when specifying the email subject line. For inquiry emails, please include the word “Inquiry” in the subject line.

We sincerely welcome all authors to submit their work and participate in the 5th International Forum on Engineering Education.

 

 

Organizing Committee of the 5th International Forum on Engineering Education
Editorial Office of Engineering Education Review (EER)
July 2026